Copper Pentasilicide (Cu₅Si)
Copper Pentasilicide (Cu₅Si)
Copper Pentasilicide (Cu₅Si)
Copper Pentasilicide (Cu₅Si)

Copper Pentasilicide (Cu₅Si)

  • element:Copper (Cu)
  • purity:High Purity
  • shape:Irregular particles
  • specification:0.8-10 µm (D50)
  • packaging:Customizable

Copper pentasilicide (Cu₅Si) is a high-purity intermetallic compound known for its excellent electrical conductivity, thermal stability, and oxidation resistance. It is widely used in semiconductor applications, electronic components, high-temperature coatings, and specialized alloy manufacturing. Due to its superior durability and efficiency, copper pentasilicide plays a crucial role in scientific research, precision engineering, and advanced material processing.

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Product Overview
Copper pentasilicide (Cu₅Si) is a binary silicide of copper, known for its high hardness, high density, and excellent electrical conductivity, thermal conductivity, ductility, and corrosion resistance. It is a metal intermetallic compound with properties between those of ionic compounds and alloys. Copper pentasilicide offers unique advantages in many high-end applications, particularly in electronic components, optoelectronic devices, and aerospace, with significant potential for further use.

Product Features

  • High Hardness and Density: Provides strong physical stability, suitable for high-strength applications.
  • Excellent Electrical and Thermal Conductivity: Ideal for high-performance electronic and thermal management applications.
  • Ductility and Corrosion Resistance: Enhances the material's durability in harsh environments, extending its service life.
  • Wear Resistance: Offers excellent surface protection, suitable for high-friction applications.

Applications

  • Electronic Components: Used in electronic devices for electrical and thermal conductivity, improving device performance.
  • Optoelectronic Devices: Applied in optoelectronic devices to enhance electrical efficiency and thermal management.
  • Aerospace: A key material in aerospace components, improving high-temperature performance and reliability.
  • Materials Science: Used in the development of new materials as an outstanding metal intermetallic compound.
  • Thermal Management: Employed in thermoelectric management applications as a high-efficiency thermal conductor.
Technical ParametersValues
NameCopper Silicide
Crystal StructurePolyhedral
Molecular FormulaCu₅Si
CAS Number12159-07-8
EINECS Number235-286-8
Color/AppearanceGray Powder
Molecular Weight345.81
Melting Point825℃
Density7.7-7.8 g/cm³

 

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