Nickel-Platinum (NiPt) alloy targets are high-performance materials used in various industrial applications, including thin film deposition, semiconductor manufacturing, and advanced coatings. They are known for their excellent thermal stability, high corrosion resistance, and unique properties.
Product Overview:
High Purity Nickel-Platinum Alloy Target Material is a silver-gray metallic target with a melting point ranging from 1400°C to 1650°C and a density of 18.63 g/cm³. It has an electrical resistivity of 29.8 µΩ·cm (at 20°C). This target material primarily consists of nickel and platinum, produced through high-temperature melting and multiple processing techniques to ensure high purity and uniformity.
Features:
- High Melting Point:Suitable for high-temperature environments with a melting point range of 1400°C to 1650°C.
- High Density:Provides good mechanical strength with a density of 18.63 g/cm³.
- Excellent Conductivity:With an electrical resistivity of 29.8 µΩ·cm, it is ideal for high-current applications.
- Uniform Composition:Processed through multiple techniques to ensure uniform composition and low oxygen content.
Applications:
- Semiconductor Industry:Used in the deposition of nickel-platinum silicide films on silicon devices through magnetron sputtering, widely applied in semiconductor contacts and interconnections.
- High-Performance Thin Films:Nickel-platinum alloy targets facilitate the production of uniform, low-particle-density high-quality films, suitable for various electronic devices.