new material
Silicon nitride ceramic target is a high-performance material designed for applications requiring superior hardness, optimized thermal stability, and excellent wear resistance. Manufactured through advanced sintering and precision processing techniques, this ceramic target offers outstanding chemical durability, high fracture toughness, and reliable compatibility with thin film deposition systems. It is widely used in semiconductor manufacturing, optical coatings, sputtering applications, and protective film deposition, ensuring long-lasting efficiency in demanding industrial environments.
Product Overview
Silicon nitride ceramic targets are high-purity materials manufactured through pressing and sintering processes, primarily used in sputter deposition and microfabrication applications. With outstanding thermal stability, mechanical properties, and high-temperature resistance, they are ideal for high-precision processes and high-temperature environments. The melting point of silicon nitride reaches 1900°C, making it highly effective in extreme conditions. These targets are used for producing high-precision electronic components and complex industrial materials.
Key Features
- High Melting Point: Melting point of up to 1900°C, making it suitable for high-temperature environments.
- High Hardness: Excellent hardness and wear resistance, ensuring long-lasting performance.
- Good Thermal Stability: Maintains structural integrity and functionality at high temperatures.
- High Purity: Available in 3N and 4N purities, ensuring superior performance.
Applications
- Microfabrication & Etching: Widely used as etching masks and insulators in integrated circuits.
- High-Temperature Materials: Suitable for materials used in rocket engines, aerospace equipment, and other high-temperature applications.
- Bearings & Mechanical Components: Silicon nitride’s hardness and wear resistance make it ideal for high-load bearings and mechanical components.
- Chemical Barriers: Used as chemical barrier materials for protection in high-temperature and chemically aggressive environments.
- Electronics Industry: Suitable for high-temperature electronic components and devices in the electronics sector.
| Silicon Nitride Ceramic Data Sheet | ||
| Performance | Unit | Typical Value |
| Density | g/cm³ | 3.26 |
| Relative Density | % | >99.5 |
| Elastic Modulus | GPa | 300~320 |
| Compression Strength Ratio | % | 40~50 |
| Hardness | GPa | 16~20 |
| Fracture Toughness | MPa·m¹/² | 6.0~9.0 |
| Bending Strength | MPa | 600~1000 |
| Poisson's Ratio | 0.25 | |
| Linear Expansion Coefficient | 10⁻⁶·K⁻¹ | 3.1~3.3 |
| Webuller Modulus | 12~15 | |
| Thermal Conductivity | W·(m·K)⁻¹ | 15~20 |
| Specific Resistance | 10¹⁸ | |
| Corrosion Resistance | Excellent | |
| Size Stability | Excellent | |
| Magnetic | None | |
