Aluminum Nitride Ceramic TO Plates (AlN Ceramic TO Plates)
Aluminum Nitride Ceramic TO Plates (AlN Ceramic TO Plates)
Aluminum Nitride Ceramic TO Plates (AlN Ceramic TO Plates)
Aluminum Nitride Ceramic TO Plates (AlN Ceramic TO Plates)

Aluminum Nitride Ceramic TO Plates (AlN Ceramic TO Plates)

  • element:AlN (Aluminum Nitride)
  • purity:High-Purity Aluminum Nitride
  • shape:Square, Rectangular Plates (Customizable)
  • specification:Available stock sizes:0.5mm x 114mm x 114mm, 1mm x 114mm x 114mm, 0.635mm x 120mm x 120mm, 1.5mm x 120mm x 120mm (Custom sizes upon request)
  • packaging:Packaging according to customer specifications

Aluminum nitride ceramic TO plates (AlN ceramic TO plates) are advanced thermal management components designed for applications requiring superior heat dissipation, excellent electrical insulation, and high mechanical stability. Manufactured using precision sintering and machining techniques, these ceramic plates provide exceptional thermal conductivity, low thermal expansion, and strong resistance to oxidation. They are widely used in semiconductor packaging, optoelectronic devices, power electronics, aerospace applications, and industrial thermal management systems, ensuring reliable efficiency in demanding environments.

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Product Overview

Aluminum Nitride Ceramic TO Plates are precision-engineered using high-purity AlN material, specifically designed for high-performance electronic applications, especially in the semiconductor industry. These plates offer excellent thermal conductivity, high-temperature stability, and corrosion resistance, making them ideal for use in LEDs, semiconductor heat management, optoelectronic communication, and other precision electronic systems. Their high precision, density, electrical insulation, and long-term stability make AlN Ceramic TO Plates crucial components in high-power electronic devices.

Features

  • High Thermal Conductivity: Superior heat dissipation capabilities that significantly lower the operating temperature of electronic devices, enhancing performance and reliability.
  • High Precision & High Density: Manufactured with precision machining to meet strict tolerances and specifications, ensuring consistent quality.
  • High-Temperature Resistance: Can operate in high-temperature environments without compromising performance, ensuring device reliability.
  • High Purity & Corrosion Resistance: Excellent resistance to corrosion, enhancing the longevity and durability of the components.
  • Electrical Insulation: Ensures electrical insulation while allowing for efficient heat dissipation, maintaining safe operation of electronic devices.
  • Stability: High mechanical strength and long-term stability for sustained performance in demanding environments.

Applications

  • LED Lighting & Displays: Used as a heat dissipation substrate for LEDs, extending their lifespan and improving efficiency.
  • Semiconductor Industry: Ideal for use in semiconductor heat sinks, ensuring thermal stability and improving the reliability of semiconductor components.
  • Optoelectronics: Used for heat management and structural support in optoelectronic devices, such as lasers and optical sensors.
  • Smartphones & Consumer Electronics: Enhances heat dissipation in devices like smartphones, tablets, and laptops, extending their lifespan and improving performance.
  • Capacitors: Applied in SMD capacitorsto ensure the stable operation of high-performance electronic components.

 

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