Aluminum Nitride Ceramic Target (AlN)
Aluminum Nitride Ceramic Target (AlN)
Aluminum Nitride Ceramic Target (AlN)
Aluminum Nitride Ceramic Target (AlN)
Aluminum Nitride Ceramic Target (AlN)
Aluminum Nitride Ceramic Target (AlN)

Aluminum Nitride Ceramic Target (AlN)

  • element:AlN (Aluminum Nitride)
  • purity:2N5 (99.5%) to 4N
  • shape:Flat target
  • specification:1Kg
  • packaging:Triple-layer vacuum packaging or argon gas protection, compliant with IATA and DOT packaging regulations

Aluminum nitride ceramic targets (AlN) are high-performance materials designed for applications requiring superior thermal conductivity, excellent electrical insulation, and outstanding mechanical stability. Produced through precision sintering and machining processes, these ceramic targets exhibit high purity, minimal thermal expansion, and exceptional resistance to oxidation and wear. They are widely used in semiconductor manufacturing, thin-film deposition, high-frequency electronic devices, aerospace components, and advanced industrial applications where thermal management and electrical insulation are critical.

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Product Overview:

Aluminum nitride ceramic target (AlN) is a high-performance ceramic material with exceptional physical and chemical properties. With a melting point of up to 2200°C, a density of 3.26 g/cm³, and a boiling point of 2517°C, aluminum nitride offers high hardness, excellent conductivity, chemical stability, and outstanding high-temperature performance. As a sputtering target, it is widely used in high-tech fields such as integrated circuits, electronic devices, and optical components, particularly excelling in high-temperature environments where it maintains stability and performance.

Product Features:

  • High Melting Point: With a melting point of 2200°C, it is suitable for extreme high-temperature environments.
  • High Hardness: Provides excellent wear resistance, making it ideal for applications that require high hardness.
  • Good Conductivity: Ensures excellent electrical conductivity, making it suitable for electronic applications.
  • Chemical Stability: Highly chemically stable, able to resist most chemical reactions.
  • High-Temperature Stability: Maintains stable physical properties even at high temperatures, suitable for use in high-temperature work environments.

Applications:

  • Integrated Circuit Deposition: Used in the deposition of thin films during integrated circuit manufacturing.
  • Electronic Devices: Widely used in the production of various electronic components such as sensors and diodes.
  • Optical Components: Used in optical coating and the production of optical elements.
  • Thermionic Emission Devices: Aluminum nitride targets are used in thermionic emission devices to improve high-temperature resistance.
  • High-Temperature Crucibles: Used in high-temperature melting processes, providing heat-resistant container materials.
  • Composite Material Manufacturing: Extensively used in the preparation of composite materials for metal and polymer matrices.
  • High-Temperature Sealants and Electronic Packaging: Used for sealing and bonding in high-temperature environments, offering excellent heat and corrosion resistance.
  • Nano-AlN Applications: Aluminum nitride is particularly suited for nanotechnology applications and is expected to see widespread use in various advanced technology industries in the future.

 

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