Aluminum nitride ceramic substrates feature excellent thermal conductivity, superior electrical insulation, and high mechanical stability. Designed for demanding applications, they enhance heat dissipation in semiconductor packaging, power electronics, and aerospace engineering.
Product Overview
Aluminum nitride ceramic substrates are high-performance materials known for their excellent thermal conductivity, wear resistance, high-temperature resistance, and corrosion resistance. These substrates are widely used in applications such as heat dissipation and printed circuit boards (PCBs). The substrates can be metallized on the surface or coated with metals like copper or silver to meet the demands of high-performance fields like integrated circuits and electronic components. Their outstanding physical and chemical properties make them crucial in electronics, semiconductors, optoelectronics, and high-power devices.
Features
- Excellent Thermal Conductivity: The thermal conductivity of aluminum nitride substrates exceeds 21W/m·K, greatly improving thermal management capabilities.
- High-Temperature and Corrosion Resistance: With exceptional resistance to high temperatures, these substrates can withstand harsh operating environments and offer corrosion resistance, extending the product's lifespan.
- High Mechanical Strength: These substrates feature high bending strength and excellent wear resistance, making them suitable for high-strength and high-pressure environments.
- Surface Metallization: The substrates can be metallized according to customer needs, ideal for applications in integrated circuits, capacitors, and other electronic products.
- High-Precision Processing: Manufactured using processes like planar grinding, CNC automation, and laser cutting to ensure dimensional accuracy and high-quality processing.
Applications
- Heat Dissipation: Widely used in heat dissipation systems for high-power electronic devices, LED lighting, and laser equipment.
- Printed Circuit Boards (PCBs): Suitable for manufacturing high-performance PCBs, especially in high-frequency circuits and power modules.
- Integrated Circuit Packaging: Used as a packaging substrate for integrated circuits, capacitors, and other components, offering efficient thermal management and electrical insulation.
- Electronics and Semiconductors: Used in semiconductor devices for thermal conduction, ensuring the stable operation of electronic equipment in high-temperature environments.
Test Item | Test Conditions | Parameter |
Volume Density | —————— | ≥3.7g/cm³ |
Flexural Strength | —————— | ≥280MPa |
Dielectric Constant | 1MHz | 9~10 |
Warping Degree | 20°C | 0.002mm/mm |
Thermal Conductivity | —————— | >21W/m·K |