new material
Product Overview
The AlSi Photonic Packaging Housing is a specialized packaging material designed for optoelectronic devices, made from aluminum-silicon alloy. This material features a thermal expansion coefficient that matches the needs of both active and passive photonic components, ensuring efficient thermal management of optoelectronic devices during operation. Its excellent thermal conductivity, low thermal deformation rate, and good machinability make it an essential material in photonic packaging. In addition, the housing can undergo electroplating and welding treatments, meeting the high standards of modern photonic technologies.
Key Features
- Thermal Expansion Coefficient Compatible with Photonic Devices:Especially suitable for use with both active and passive photonic components, minimizing thermal stress.
- High Thermal Conductivity:Effectively dissipates heat, extending the lifespan of photonic devices.
- Low Thermal Deformation Rate:Maintains stability in high-temperature working environments.
- Excellent Machinability:Suitable for precision machining, easy to customize and manufacture.
- Electroplating and Welding Compatible:Allows for further processing and surface treatment, enhancing product performance and reliability.
Applications
- Optoelectronic Device Packaging:Widely used in the packaging of photonic components such as lasers, fiber optic communication modules, and optoelectronic sensors.
- Optoelectronics Industry:Provides thermal management and protection for optoelectronic equipment, ensuring stable operation.
- Semiconductor Field:Used as a packaging material for high-power semiconductor devices, helping to achieve efficient thermal management.
- Communication Equipment:Applied in packaging communication devices that require high thermal conductivity and low thermal expansion coefficients, ensuring signal transmission stability.
- High-Performance Optical Components:Supports long-term operation of optical components and equipment, minimizing performance fluctuations caused by thermal stress.
