new material
Product Overview
The AlSi Multilayer Circuit Packaging material is a high-performance solution specifically designed for multilayer circuit board packaging. Made from aluminum-silicon alloy, it offers excellent thermal conductivity and low-density properties, ensuring superior heat dissipation in high-power applications. This material can be precision etched to meet the high-precision requirements of devices, making it ideal for the packaging of various high-frequency electronic devices and microelectronic systems. Its excellent machinability, electroplating, and weldability make it widely applicable in the electronics manufacturing and packaging industries.
Key Features
- Low Density:Effectively reduces the overall weight of the circuit board, suitable for lightweight designs in electronic devices.
- High Thermal Conductivity and Good Heat Dissipation:Ensures stable operation of electronic components in high-power or high-frequency applications.
- Precision Etching Capability:Offers small device tolerances and high precision, meeting the requirements of complex circuit designs.
- Machinability and Electroplating Compatibility:Can be precisely processed, surface-treated, and welded based on customer needs to improve device performance and reliability.
Applications
- Electronics Packaging:Widely used for multilayer circuit boards, microelectronic components, and high-frequency circuit packaging.
- Communication Equipment:Applied in high-frequency circuits and microwave communication device packaging, ensuring stable signal transmission.
- Power Electronics:Ideal for heat management of high-power electronic devices, such as power modules and amplifiers.
- Microelectronics and Semiconductor Industries:Provides packaging solutions for high-precision electronic systems, ensuring efficient heat dissipation and stable operation.
- Aerospace and Military:Used in aerospace and military electronics to meet the high-performance demands of devices operating in harsh environmental conditions.
