Tungsten Copper (WCu) Packaging Material

Product Overview

Tungsten Copper (WCu) is a composite material consisting of tungsten and copper, combining tungsten's low thermal expansion properties with copper's high thermal conductivity. The material's thermal expansion coefficient and conductivity can be tailored by adjusting the composition ratio to meet specific application requirements. WCu is commonly used in industries that require high thermal performance, such as RF, microwave, high-power semiconductor packaging, and optical communication, due to its excellent thermal expansion matching capabilities, which ensure a reliable thermal interface with ceramics and other conductor materials.

Key Features

• High Thermal Conductivity:Offers superior heat conduction, making it ideal for high-power density devices.
• Low Thermal Expansion:Exceptional thermal expansion matching, particularly beneficial for high-precision applications.
• Excellent Air Tightness:Ensures the stability and long-term reliability of the packaging components.
• Surface Quality:Provides excellent dimensional control, surface finish, and flatness.
• Customization Options:Available as semi-finished or fully finished products with nickel or gold plating to meet different needs.

Applications

• RF and Microwave Devices:Used in RF and microwave packaging, providing effective thermal management for high-frequency electronic devices.
• Semiconductor Packaging:Ensures efficient heat dissipation and stable thermal expansion matching in high-power semiconductor packaging.
• Optical Communication:Applied in thermal management for optical communication devices, ensuring long-term stable operation.
• High-Power Electronics:Widely used in high-power device packaging, ensuring excellent thermal conductivity and temperature control performance.