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Single crystal diamond micro powder is a high-purity synthetic diamond material engineered for applications requiring ultra-fine abrasives, precision polishing, and extreme hardness. Manufactured through controlled crystallization and micronization processes, this powder features uniform particle size, superior thermal conductivity, and outstanding wear resistance. It is widely used in semiconductor wafer polishing, optical lens finishing, ceramic processing, and high-precision machining, ensuring exceptional surface quality and durability in demanding industrial applications.
Product Overview
This Single Crystal Diamond Micro Powder is made from high-purity single crystal diamonds processed into fine particles. It offers high toughness, making it especially suitable for the processing of non-metallic materials such as stones and gemstones. The particle size distribution is carefully controlled to ensure excellent performance in grinding and polishing materials like silicon wafers, glass, and ceramics.
Features
- High Polishing Finish: The micro powder provides superior polishing performance, achieving a high-gloss finish on surfaces.
- High Polishing Efficiency: Exhibits excellent efficiency during polishing, saving both time and cost.
- Good Toughness: Its higher toughness ensures stability during grinding and polishing processes.
- Strict Particle Size Control: The precise particle size distribution makes it ideal for delicate grinding and polishing applications, particularly in precision industries.
Applications
- Stone Processing: Used for fine grinding and polishing of stone materials, enhancing their gloss.
- Gemstone Processing: Suitable for polishing and fine processing of gemstones.
- Non-Metallic Material Processing: Particularly suitable for grinding and polishing materials like silicon wafers, glass, and ceramics, ensuring smooth and flawless surfaces.
- Super Polishing Applications: Widely used in high-demand super polishing fields, such as the polishing of precision equipment and optical components.
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