new material
Product Overview
High-purity tin (Sn) offers excellent chemical stability and high purity, making it ideal for precision electronics and semiconductor manufacturing. It has a silvery-white appearance, a melting point of 231.89°C, a density of 7.28 g/cm³, and a boiling point of 2260°C.
Key Features
- Ultra-high Purity:Purity up to 99.999%, suitable for fields requiring high precision and demand.
- Versatile Forms:Available in particle, lump, plate, and rod forms to meet varied application needs.
- Excellent Stability:Performs stably in high-temperature environments, with good conductivity and oxidation resistance.
Applications
- Semiconductor Manufacturing:Used in the production of compound semiconductors (such as PbxSn1-xTe) and as a doping material in semiconductor compounds.
- High-Purity Alloy:Essential in high-purity alloy production, including ultra-low temperature cooling alloys.
- Superconducting Materials:Plays an important role in producing superconducting materials, such as Nb₂Sn.
- Soldering and Coatings:Utilized as a high-purity solder material and as a foundational material for ITO coatings.
| Specification | Purity | Major Impurities | Total Impurities | Testing Method |
| High Purity Tin | 99.995% | Mg 、Al 、Si 、P 、S 、V 、Cr 、Mn 、Fe 、Co 、Cu 、Zn 、Ag | <50ppm | ICP-MS |
| Ultra Pure Tin | 99.99% | Mg 、Al 、Si 、P 、S 、V 、Cr、Mn、Fe、Co、Cu、Zn、Ag | <10ppm | GDMS |
| Ultra High Purity Tin | 99.999% | Mg 、Al 、Si 、P 、S 、V 、Cr 、Mn 、Fe 、Co 、Cu 、Zn 、Ag | <1ppm | GDMS |
