new material
High-oriented, high thermal conductivity graphite materials are advanced carbon-based components engineered for applications requiring superior heat dissipation, electrical conductivity, and mechanical stability. Manufactured using precision-structured graphite layers, these materials provide optimized thermal management, minimal expansion, and excellent oxidation resistance. They are widely used in semiconductor cooling systems, aerospace thermal shielding, battery heat dissipation, and high-performance electronic devices, ensuring efficient energy transfer and thermal stability in demanding conditions.
Product Overview
High-Oriented, High Thermal Conductivity Graphite Materials are advanced graphite materials specifically designed for high-end electronics and energy management applications. With exceptional thermal conductivity and mechanical strength, the material’s bidirectional thermal conductivity reaches 530 W/m.K, ensuring efficient heat dissipation. Its high volume density (≥1.9 g/cm³) guarantees material stability and durability. The material’s compressive strength of 18 MPa and flexural strength of 12 MPa make it suitable for applications demanding high strength and efficient thermal management. It is widely used in industries such as electronics, power LEDs, and new energy technologies.
Key Features
- High Bidirectional Thermal Conductivity (≥530 W/m.K): Significantly improves heat dissipation performance.
- High Volume Density (≥1.9 g/cm³): Ensures stability and durability in demanding applications.
- Excellent Mechanical Strength: Compressive strength of 18 MPa and flexural strength of 12 MPa.
- High Purity Graphite: Meets the requirements of various high-end technology applications.
Applications
- High-End Electronics Industry: Thermal management for high-performance components and devices.
- High-Power LED Industry: Efficient heat dissipation for large-power LED modules.
- New Energy Sector: Thermal management systems for power battery packs in electric vehicles.
- High-Power Power Supplies and PCB Cooling: Effective heat management for high-power electronics.
- Computing Systems: Thermal solutions for large-scale CPU cooling and industrial devices.
- Electromagnetic Shielding and Nuclear Radiation Absorption: Used in specialized applications requiring material strength and heat management.
| Item | Value |
| Density | ≥1.9 g/cm³ |
| Thermal Conductivity (Biaxial) | 530 W/m·K |
| Compressive Strength | 18 MPa |
| Bending Strength | 12 MPa |
