Tungsten silicide (WSi₂) is a high-purity intermetallic compound known for its exceptional electrical conductivity, thermal stability, and oxidation resistance. It is widely used in semiconductor manufacturing, microelectronics, high-temperature coatings, and aerospace applications. With superior durability and efficiency, tungsten silicide plays a crucial role in advanced materials engineering, energy conversion systems, and precision electronic components.
Product Overview
Tungsten silicide (WSi2) is a compound of tungsten and silicon, known for its high melting point and good electrical conductivity. As an inorganic compound, tungsten silicide is a typical conductive ceramic material with excellent thermal stability and oxidation resistance. Its blue-gray, tetragonal crystal structure makes it suitable for high-temperature environments.
Product Features
- High Melting Point:With a melting point of 2160°C, it is ideal for high-temperature applications.
- Electrical Conductivity:It has a low resistivity of 60-80 μΩ cm, making it suitable for microelectronics.
- High Temperature Resistance:It remains stable in high-temperature environments, particularly at 1000°C.
- Oxidation Resistance:It performs well in high-temperature radiation cooling and insulation applications.
Applications
- Microelectronics:Used as contact materials to improve signal speed.
- Thin Film Deposition:Serves as a current shunt for polycrystalline silicon lines to enhance conductivity.
- Microelectromechanical Systems (MEMS):Used in the production of thin films for microcircuits.
- High-Temperature Radiation Cooling:Used as a high emissivity coating in high-temperature environments for oxidation protection.
- Barrier Layers:Acts as a barrier between silicon and other metals, such as tungsten.
Technical Parameters | Values |
Name | Tungsten Silicide (WSi₂) |
CAS Number | 12039-88-2 |
Molecular Formula | WSi₂ |
Product Code | 741400PD |
Purity | 99.50% |
Specification | -625 mesh, -200 mesh |
EINECS Number | 234-909-0 |
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