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Product Overview
Copper-Molybdenum-Copper (CMC) is a "sandwich-structured" composite material with a molybdenum core layer bonded between two layers of pure copper. This design allows for customizable thermal expansion coefficients while maintaining excellent strength and high thermal conductivity. The material can be processed into various shapes and has outstanding formability, making it an ideal choice for high-performance packaging and thermal management applications.
Key Features
- Adjustable Expansion Coefficient:Designed to match the thermal expansion needs of different devices.
- High Strength and Thermal Conductivity:Excellent performance in heat dissipation and load-bearing applications.
- Ease of Processing:Supports stamping and forming with ease.
Applications
- Electronic Packaging:Suitable for high-frequency devices and power module packaging.
- Thermal Substrates:Used as heat sinks and baseplates in high-power density environments.
- High-Performance Device Manufacturing:Applied in aerospace, microelectronics, and advanced semiconductor industries.
| Thickness Ratio | Density (g/cm²) | Thermal Expansion Coefficient (10⁻⁶/K) | Thermal Conductivity (W/m·K) x-y Direction | Thermal Conductivity (W/m·K) x-z Direction |
| 1:1:1 | 9.4 | 9.4 | 300~310 | 240~250 |
| 1:2:1 | 9.6 | 7.7 | 260~270 | 210~220 |
| 1:3:1 | 9.7 | 6.9 | 230~240 | 190~200 |
| 1:4:1 | 9.8 | 6.2 | 210~220 | 170~180 |
| 13:74:13 | 9.9 | 5.8 | 190~200 | 160~170 |
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