Copper-Manganese (CuMn) Alloy Target

Product Overview

The copper-manganese target is a high-purity metallic target used for magnetron sputtering. Made from high-purity copper and manganese, it plays a crucial role in semiconductor manufacturing. It is essential in the preparation of metal interconnect layers, metal contact layers, and diffusion barrier layers in integrated circuits.

Key Features

• High Purity:With 3N (99.9%) purity, this target ensures excellent performance and reliability during the coating process.
• Variety of Shapes:Available in block, sheet, and custom shapes to accommodate different equipment and process requirements.
• Stability:Exhibits excellent physical and chemical stability, making it suitable for demanding industrial environments.

Applications

• Semiconductor Manufacturing:Widely used in the preparation of metal interconnects, contact layers, and diffusion barriers in integrated circuits, ensuring circuit performance and stability.
• Optoelectronic Devices:Enhances the conductivity and overall performance of optoelectronic components during manufacturing.
• High-Performance Films:Suitable for producing high-performance film materials used in various electronic devices and functional coatings.