Tungsten Copper (WCu) is a composite material consisting of tungsten and copper, combining tungsten’s low thermal expansion properties with copper’s high thermal conductivity. The material’s thermal expansion coefficient and conductivity can be tailored by adjusting the composition ratio to meet specific application requirements. WCu is commonly used in industries that require high thermal performance, such as RF, microwave, high-power semiconductor packaging, and optical communication, due to its excellent thermal expansion matching capabilities, which ensure a reliable thermal interface with ceramics and other conductor materials.

Key Features

• High Thermal Conductivity:Offers superior heat conduction, making it ideal for high-power density devices.
• Low Thermal Expansion:Exceptional thermal expansion matching, particularly beneficial for high-precision applications.
• Excellent Air Tightness:Ensures the stability and long-term reliability of the packaging components.
• Surface Quality:Provides excellent dimensional control, surface finish, and flatness.
• Customization Options:Available as semi-finished or fully finished products with nickel or gold plating to meet different needs.

Applications

• RF and Microwave Devices:Used in RF and microwave packaging, providing effective thermal management for high-frequency electronic devices.
• Semiconductor Packaging:Ensures efficient heat dissipation and stable thermal expansion matching in high-power semiconductor packaging.
• Optical Communication:Applied in thermal management for optical communication devices, ensuring long-term stable operation.
• High-Power Electronics:Widely used in high-power device packaging, ensuring excellent thermal conductivity and temperature control performance.

CPC (Copper Molybdenum Copper) is a composite material consisting of copper and molybdenum, with a copper-clad molybdenum core structure. The typical structure ratio is Cu:Mo-Cu:Cu 1:4:1. This material combines the excellent electrical conductivity of copper with the high-temperature stability of molybdenum, offering higher thermal conductivity and lower cost compared to traditional materials like W(Mo)-Cu and Cu/Mo/Cu. CPC is widely used in electronic packaging applications that require high thermal conductivity and thermal stability, particularly in RF, microwave, and high-power semiconductor devices.

Key Features

• High Thermal Conductivity:Provides superior heat dissipation compared to traditional W(Mo)-Cu and Cu/Mo/Cu materials.
• Excellent Interface Bonding:Can withstand thermal shock up to 850°C, ensuring reliability under high thermal stress.
• Ease of Machining:Easier to process and stamp into large components compared to CMC (Copper Matrix Composites).
• Non-Magnetic:Suitable for applications with strict magnetic requirements.
• Cost Advantage:More affordable compared to other high-thermal-conductivity materials, offering a cost-effective solution without compromising performance.

Applications

• RF and Microwave Devices:Ideal for RF, microwave components, and high-power semiconductor packaging.
• Semiconductor Industry:Used for packaging high-power semiconductor devices, ensuring effective heat dissipation and thermal management.
• Electronics Packaging:Widely used in electronic packaging applications where high thermal conductivity and high-temperature resistance are required.
• High-Power Devices:Provides excellent thermal management for high-power devices, ensuring stable heat conduction and temperature control.

Copper-Molybdenum-Copper (CMC) is a “sandwich-structured” composite material with a molybdenum core layer bonded between two layers of pure copper. This design allows for customizable thermal expansion coefficients while maintaining excellent strength and high thermal conductivity. The material can be processed into various shapes and has outstanding formability, making it an ideal choice for high-performance packaging and thermal management applications.

Key Features

• Adjustable Expansion Coefficient:Designed to match the thermal expansion needs of different devices.
• High Strength and Thermal Conductivity:Excellent performance in heat dissipation and load-bearing applications.
• Ease of Processing:Supports stamping and forming with ease.

Applications

• Electronic Packaging:Suitable for high-frequency devices and power module packaging.
• Thermal Substrates:Used as heat sinks and baseplates in high-power density environments.
• High-Performance Device Manufacturing:Applied in aerospace, microelectronics, and advanced semiconductor industries.

Product Features

• High Thermal Conductivity:Free from sintering activation elements like Fe and Co, ensuring superior thermal conductivity.
• Excellent Sealing Performance:Offers exceptional hermeticity, ideal for applications requiring high gas tightness.
• Lower Density:Compared to tungsten-copper, MoCu has a lower density, making it suitable for lightweight applications in electronic devices and aerospace.
• Customizable Forms:When the molybdenum content is less than 75%, rolling plates can be provided, making it easier to stamp into parts.
• Surface Treatment:Available as semi-finished products or finished products with Ni/Au plating on the surface.

Applications
Molybdenum copper packaging material is widely used in aerospace, particularly for electronic devices and packaging materials that require high thermal conductivity, low density, and excellent hermetic properties.

Aluminum Silicon Carbide (AlSiC) is a composite material that combines the advantages of aluminum and silicon carbide, offering exceptional properties such as low density, low thermal expansion, and high thermal conductivity. This material is primarily used in high-temperature and high-pressure environments and is ideal for electronic packaging, thermal management, and mechanical parts. Its outstanding thermal conductivity and stability make it the material of choice for high-performance electronic devices.

Key Features

• Low Density:Provides a lighter packaging solution compared to traditional materials.
• Low Thermal Expansion Coefficient:Ideal for high-temperature applications, reducing thermal stress.
• High Thermal Conductivity:Effectively enhances heat management, suitable for applications requiring fast heat dissipation.
• High-Temperature and Chemical Stability:Can withstand harsh working conditions.
• Customizable Processing:Materials and specifications can be tailored to meet specific needs.

Applications

• Electronic Packaging:Used in high-performance semiconductor packaging, providing excellent thermal management and electrical isolation.
• Thermal Management:Applied in high-power electronic devices as heat dissipation components.
• Automotive and Aerospace:Utilized as a thermal management material for engines, electronic systems, and other critical components.
• Mechanical Components:Offers stable mechanical properties in high-temperature and high-pressure environments.
• Medical Devices:Widely used in devices that require high thermal conductivity and reliability.

The AlSi Hybrid Circuit Packaging Enclosure is a high-quality composite material made from aluminum-silicon alloy, offering excellent thermal conductivity, low thermal expansion coefficient, and high mechanical strength. This material has an adjustable thermal expansion coefficient, providing a stable environment for sensitive electronic devices. It is widely used for packaging high-power circuits. Its low density, good conductivity, and excellent electromagnetic interference (EMI)/radio frequency interference (RFI) shielding make it an ideal packaging material in the microelectronics field.

Key Features

• Adjustable Thermal Expansion Coefficient:Can be tailored to meet the thermal expansion needs of different electronic components.
• Low Density:Reduces the overall weight of the device, suitable for lightweight designs.
• High Thermal Conductivity:Effectively manages heat dissipation, improving system stability.
• Excellent Conductivity:Provides strong electromagnetic interference shielding, protecting circuits from external disruptions.
• High Hardness & Thermal Mechanical Stability:Enhances the material’s durability and long-term stability.
• High Density:Ensures the integrity of the material, preventing the ingress of air or contaminants.
• Easy to Process & Highly Compatible:Suitable for microelectronics assembly processes, including machining and electroplating treatments.

Applications

• Electronic Device Packaging:Ideal for high-power circuits and precision electronic device packaging, offering effective thermal management and protection.
• Electromagnetic Compatibility:Widely used in environments requiring electromagnetic shielding, such as RF devices and high-frequency circuits.
• Microelectronics Industry:Used as a packaging material in microelectronics assembly, including integrated circuits, sensors, and other miniature components.
• Automotive & Aerospace:Applied in electronic packaging for high-temperature and high-vibration environments, ensuring long-term stability and performance.
• Medical Equipment:Used for packaging in electronic devices, particularly in medical instruments with strict EMI requirements.

The AlSi Photonic Packaging Housing is a specialized packaging material designed for optoelectronic devices, made from aluminum-silicon alloy. This material features a thermal expansion coefficient that matches the needs of both active and passive photonic components, ensuring efficient thermal management of optoelectronic devices during operation. Its excellent thermal conductivity, low thermal deformation rate, and good machinability make it an essential material in photonic packaging. In addition, the housing can undergo electroplating and welding treatments, meeting the high standards of modern photonic technologies.

Key Features

• Thermal Expansion Coefficient Compatible with Photonic Devices:Especially suitable for use with both active and passive photonic components, minimizing thermal stress.
• High Thermal Conductivity:Effectively dissipates heat, extending the lifespan of photonic devices.
• Low Thermal Deformation Rate:Maintains stability in high-temperature working environments.
• Excellent Machinability:Suitable for precision machining, easy to customize and manufacture.
• Electroplating and Welding Compatible:Allows for further processing and surface treatment, enhancing product performance and reliability.

Applications

• Optoelectronic Device Packaging:Widely used in the packaging of photonic components such as lasers, fiber optic communication modules, and optoelectronic sensors.
• Optoelectronics Industry:Provides thermal management and protection for optoelectronic equipment, ensuring stable operation.
• Semiconductor Field:Used as a packaging material for high-power semiconductor devices, helping to achieve efficient thermal management.
• Communication Equipment:Applied in packaging communication devices that require high thermal conductivity and low thermal expansion coefficients, ensuring signal transmission stability.
• High-Performance Optical Components:Supports long-term operation of optical components and equipment, minimizing performance fluctuations caused by thermal stress.

Aluminum Silicon (AlSi) alloy is a lightweight, high thermal conductivity material with a controllable low thermal expansion coefficient. Due to its excellent machining properties, such as ease of CNC machining, electroplating, and welding, AlSi alloy is widely used in the electronic packaging industry, especially for high-temperature, high-power devices with demanding thermal management requirements. It can replace traditional packaging materials like AlSiC, copper tungsten (CuW), and copper molybdenum (CuMo), providing superior performance and cost-efficiency.

Key Features

• Lightweight:With a lower density, it is ideal for applications that require lightweight design solutions.
• Low Thermal Expansion Coefficient:Strong stability, suitable for environments with significant temperature variations.
• High Thermal Conductivity:Effectively improves heat management, essential for high-power devices.
• Excellent Machining Performance:Easily processed with CNC machining, electron beam welding, laser welding, etc.
• Good Electroplating Performance:Can be electroplated with gold, silver, copper, nickel, etc.
• Alternative to Traditional Materials:In certain fields, can replace AlSiC, CuW, CuMo, etc.

Applications

• Electronic Packaging:Widely used for packaging high-power electronic components, providing efficient heat management.
• Thermal Management:Applied in heat sinks and cooling components, especially in high-power, high-temperature environments.
• Automotive and Aerospace:Used as a thermal conductivity material in engine systems and electronic systems.
• Welding and Electroplating:Employed in high-performance welding and electroplating applications.
• Mechanical and Electrical Fields:Used in various mechanical and electronic devices to provide structural stability and thermal conductivity.

The AlSi Multilayer Circuit Packaging material is a high-performance solution specifically designed for multilayer circuit board packaging. Made from aluminum-silicon alloy, it offers excellent thermal conductivity and low-density properties, ensuring superior heat dissipation in high-power applications. This material can be precision etched to meet the high-precision requirements of devices, making it ideal for the packaging of various high-frequency electronic devices and microelectronic systems. Its excellent machinability, electroplating, and weldability make it widely applicable in the electronics manufacturing and packaging industries.

Key Features

• Low Density:Effectively reduces the overall weight of the circuit board, suitable for lightweight designs in electronic devices.
• High Thermal Conductivity and Good Heat Dissipation:Ensures stable operation of electronic components in high-power or high-frequency applications.
• Precision Etching Capability:Offers small device tolerances and high precision, meeting the requirements of complex circuit designs.
• Machinability and Electroplating Compatibility:Can be precisely processed, surface-treated, and welded based on customer needs to improve device performance and reliability.

Applications

• Electronics Packaging:Widely used for multilayer circuit boards, microelectronic components, and high-frequency circuit packaging.
• Communication Equipment:Applied in high-frequency circuits and microwave communication device packaging, ensuring stable signal transmission.
• Power Electronics:Ideal for heat management of high-power electronic devices, such as power modules and amplifiers.
• Microelectronics and Semiconductor Industries:Provides packaging solutions for high-precision electronic systems, ensuring efficient heat dissipation and stable operation.
• Aerospace and Military:Used in aerospace and military electronics to meet the high-performance demands of devices operating in harsh environmental conditions.