CPC – Copper Molybdenum Copper Packaging Material

Product Overview

CPC (Copper Molybdenum Copper) is a composite material consisting of copper and molybdenum, with a copper-clad molybdenum core structure. The typical structure ratio is Cu:Mo-Cu:Cu 1:4:1. This material combines the excellent electrical conductivity of copper with the high-temperature stability of molybdenum, offering higher thermal conductivity and lower cost compared to traditional materials like W(Mo)-Cu and Cu/Mo/Cu. CPC is widely used in electronic packaging applications that require high thermal conductivity and thermal stability, particularly in RF, microwave, and high-power semiconductor devices.

Key Features

• High Thermal Conductivity:Provides superior heat dissipation compared to traditional W(Mo)-Cu and Cu/Mo/Cu materials.
• Excellent Interface Bonding:Can withstand thermal shock up to 850°C, ensuring reliability under high thermal stress.
• Ease of Machining:Easier to process and stamp into large components compared to CMC (Copper Matrix Composites).
• Non-Magnetic:Suitable for applications with strict magnetic requirements.
• Cost Advantage:More affordable compared to other high-thermal-conductivity materials, offering a cost-effective solution without compromising performance.

Applications

• RF and Microwave Devices:Ideal for RF, microwave components, and high-power semiconductor packaging.
• Semiconductor Industry:Used for packaging high-power semiconductor devices, ensuring effective heat dissipation and thermal management.
• Electronics Packaging:Widely used in electronic packaging applications where high thermal conductivity and high-temperature resistance are required.
• High-Power Devices:Provides excellent thermal management for high-power devices, ensuring stable heat conduction and temperature control.