AlSi Hybrid Circuit Packaging Enclosure

Product Overview

The AlSi Hybrid Circuit Packaging Enclosure is a high-quality composite material made from aluminum-silicon alloy, offering excellent thermal conductivity, low thermal expansion coefficient, and high mechanical strength. This material has an adjustable thermal expansion coefficient, providing a stable environment for sensitive electronic devices. It is widely used for packaging high-power circuits. Its low density, good conductivity, and excellent electromagnetic interference (EMI)/radio frequency interference (RFI) shielding make it an ideal packaging material in the microelectronics field.

Key Features

• Adjustable Thermal Expansion Coefficient:Can be tailored to meet the thermal expansion needs of different electronic components.
• Low Density:Reduces the overall weight of the device, suitable for lightweight designs.
• High Thermal Conductivity:Effectively manages heat dissipation, improving system stability.
• Excellent Conductivity:Provides strong electromagnetic interference shielding, protecting circuits from external disruptions.
• High Hardness & Thermal Mechanical Stability:Enhances the material's durability and long-term stability.
• High Density:Ensures the integrity of the material, preventing the ingress of air or contaminants.
• Easy to Process & Highly Compatible:Suitable for microelectronics assembly processes, including machining and electroplating treatments.

Applications

• Electronic Device Packaging:Ideal for high-power circuits and precision electronic device packaging, offering effective thermal management and protection.
• Electromagnetic Compatibility:Widely used in environments requiring electromagnetic shielding, such as RF devices and high-frequency circuits.
• Microelectronics Industry:Used as a packaging material in microelectronics assembly, including integrated circuits, sensors, and other miniature components.
• Automotive & Aerospace:Applied in electronic packaging for high-temperature and high-vibration environments, ensuring long-term stability and performance.
• Medical Equipment:Used for packaging in electronic devices, particularly in medical instruments with strict EMI requirements.