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KH550-treated nanometer silica provides optimized surface modification, superior dispersibility, and enhanced chemical stability. Designed for polymer reinforcement, coatings, and industrial applications, it ensures improved adhesion, extended durability, and high adaptability.
Product Overview
KH550-treated nanometer silica is a silica material modified with the KH550 coupling agent, which improves the surface properties by converting its hydrophilic nature to hydrophobic. This treatment enhances the dispersion and stability of nanometer silica, making it more suitable for various applications. The chemical modification reacts with the hydroxyl groups on the silica surface, effectively enhancing the silica’s oleophilicity. This modified silica is widely used in fields such as polymer composites, coatings, adhesives, and electronic materials.
Key Features
- Enhanced Hydrophobicity:KH550 treatment significantly improves the oleophilic properties of nanometer silica, making it ideal for applications requiring hydrophobicity.
- Improved Dispersion:KH550 modification prevents particle agglomeration, enhancing dispersion and improving the overall performance of composite materials.
- Mechanical Property Enhancement:The modified silica improves the stability of composites, enhancing their mechanical strength and durability.
- Stability & Electrical Insulation:Maintains stability at high temperatures and exhibits excellent electrical insulation properties, making it suitable for electronic applications.
Applications
- Oil-Water Separation:KH550-modified SiO₂/PU composite membranes show high-efficiency separation performance in oil-water separation applications.
- Polymer Composites:Used as a reinforcing filler to improve the mechanical properties, thermal stability, and wear resistance of plastics, rubbers, and other polymers.
- Coatings & Paints:Enhances adhesion, weather resistance, and corrosion resistance in coatings, such as improving the bonding strength between coatings and metal substrates in automotive paints.
- Adhesives:Enhances the bonding strength and durability of adhesives, ensuring good performance even in harsh environments.
- Electronic Materials:Used in electronic packaging materials to improve thermal conductivity and electrical insulation properties.
| Parameter | Value |
| Appearance | White fluffy powder |
| Particle Size Range | 20 nm |
| Purity | >99% |
| Specific Surface Area | 122.17 m²/g |
| Surface Modification | KH550 treatment |
| Characteristics | Good oleophilicity and hydrophilicity |
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