Ellipsoidal Alumina Thermal Conductive Powder
Ellipsoidal Alumina Thermal Conductive Powder
Ellipsoidal Alumina Thermal Conductive Powder
Ellipsoidal Alumina Thermal Conductive Powder

Ellipsoidal Alumina Thermal Conductive Powder

  • element:Aluminum (Al), Oxygen (O)
  • purity:≥99.9%
  • shape:Ellipsoidal Powder
  • specification:10-50 nm
  • packaging:Bulk packaging (25 kg/bag); Sample packaging (5 kg/bag)

Ellipsoidal alumina thermal conductive powder provides optimized heat dissipation, superior mechanical strength, and enhanced dispersion uniformity. Designed for advanced applications, it ensures efficient thermal conductivity, extended durability, and high-performance adaptability.

Inquire

Product Overview

Ellipsoidal alumina thermal conductive powder is a premium thermal filler designed to enhance thermal conductivity. The powder adopts an ellipsoidal structure, produced through a specialized preparation process, significantly improving dispersion and thermal conductivity in various thermal materials. It is widely used in electronics, communications, LED technology, and other fields requiring efficient thermal management.

Features

  • High Purity: Provides excellent thermal conductivity and stability.
  • Ellipsoidal Particles: The unique ellipsoidal structure improves powder flowability and dispersion, effectively increasing the thermal conductivity of composite materials.
  • Good Thermal Stability: Maintains stable thermal conductivity even in high-temperature environments, suitable for demanding thermal management applications.
  • High Thermal Conductivity: Significantly enhances the thermal conductivity of composite materials, ideal for a wide range of heat dissipation applications.

Applications

  • Thermal Phase Change Materials: Used in thermal management materials, such as flexible circuit boards (CCL).
  • Epoxy Potting and Molding Compounds: Acts as a filler to enhance the thermal conductivity of materials.
  • Thermal Conductive Aluminum Substrates: Widely used in aluminum circuit boards for high-efficiency heat dissipation.
  • Thermal Conductive Silicone Pads, Grease, and Encapsulants: Provides efficient thermal management solutions for electronics, LEDs, and other applications.

 

ModelParticle ShapeAverage Particle Size (D50)Al₂O₃ PurityNotes
LA001TEllipsoidal1μm≥99.8%Particle size can be customized, with D50 options of 2μm, 5μm, 10μm, 15μm, 22μm, 30μm, 50μm, 70μm
LA005TEllipsoidal5μm≥99.8%
Submit Your RequirementsWe will contact you within 24 hours.
*
*
*

Inquiry Details

Retail PurchaseProduct ConsultationProduct Quotation*

Preference

Purchase Existing ProductsCustomized Solutions
In Progress....
Success!
Failed!
Email Error!
Phone Error!
Expand more!
Ellipsoidal Alumina Thermal Conductive PowderEllipsoidal Alumina Thermal Conductive Powder

Click on the inquiry