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Nickel Silicide (NiSi) is an intermetallic compound composed of nickel and silicon. It is widely used in microelectronics, semiconductor devices, and thin-film applications due to its low electrical resistivity, thermal stability, and compatibility with silicon-based technologies. NiSi is commonly employed in contact metallization, diffusion barriers, and high-temperature coatings.
Product Overview:
Nickel silicide (NiSi) is a metal silicide composed of nickel and silicon, known for its excellent electrical conductivity and chemical stability. It is widely used in high-temperature and high-pressure environments and is a common material in the electronics and semiconductor industries.
Product Features:
- High Purity:With a purity of 99.9%, ensuring superior material quality and performance.
- Excellent Electrical Conductivity:Retains good electrical conductivity even at high temperatures.
- Chemical Stability:Demonstrates strong stability in various chemical environments, making it suitable for harsh conditions.
Applications:
- Electronic Components:Used as a thin-film electrode material in semiconductor devices and integrated circuits.
- High-Temperature Materials:Applied in electronic components or contact materials under high-temperature and high-pressure conditions.
- High-Conductivity Materials:Widely used in fields requiring high electrical conductivity, such as electric heating devices and electrical connection components.
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