Boron Nitride Nanosheets
Boron Nitride Nanosheets
Boron Nitride Nanosheets
Boron Nitride Nanosheets

Boron Nitride Nanosheets

  • element:Boron (B), Nitrogen (N)
  • purity:98 wt%
  • shape:Nanosheets
  • specification:Nanosheet Diameter: 0.1-0.4 µm
  • packaging:Customizable

Boron nitride nanosheets provide optimized thermal stability, superior mechanical strength, and enhanced electrical insulation. Designed for high-performance coatings and electronic applications, they ensure efficient heat dissipation, extended durability, and high adaptability.

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Product Overview
Boron nitride nanosheets (BNNSs) are a type of two-dimensional nanomaterial characterized by their unique structure and properties. Boron (B) and nitrogen (N) atoms are covalently bonded to form a layered structure similar to graphite. These nanosheets exhibit excellent electrical insulation and exceptional thermal conductivity, making them widely used in electronic devices, thermal management materials, and high-performance composites. The synthesis methods for BNNSs include chemical vapor deposition (CVD) and high-temperature, high-pressure methods. The product is highly dispersible in solution, with stable suspensions that do not easily settle.

Key Features

  • Superior Thermal Stability:BNNSs maintain their structural integrity in high-temperature environments, making them ideal for extreme thermal conditions.
  • Chemical Inertness:They exhibit high chemical stability in most chemical environments, making them suitable for demanding applications.
  • High Thermal Conductivity:Excellent thermal conduction properties make BNNSs ideal for use in thermal management applications.
  • Electrical Insulation:BNNSs offer exceptional electrical insulation properties, making them useful in electronic and electrical applications.

Applications

  • Insulation and Thermal Management Materials:Due to their high electrical insulation and thermal conductivity, BNNSs are ideal for use in insulating and heat-dissipating layers in electronic devices.
  • Electronic Packaging Materials:When incorporated into polymer matrices, BNNSs enhance the mechanical strength, insulation, and thermal stability of electronic packaging materials without interfering with the function of electronic components.
  • Reinforcement Materials:BNNSs can be added to polymer, ceramic, or metal-based composite materials to significantly improve the mechanical properties and performance of the materials.

 

ParameterValue
Purity98 wt%
Flake Size0.1-0.4 μm
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