High-Temperature Resistant Self-Release Film

Product Overview
The high-temperature resistant self-release film is specially designed for flexible printed circuit board (FPC) production, offering excellent high-temperature resistance, filling capability, and release performance. During the FPC manufacturing process, this film effectively prevents adhesion of the protective cover, reducing defects such as adhesive overflow and wrinkles during lamination. It provides superior stability in high-temperature environments, ensuring no influence from temperature variations during production.

Product Features

• High-Temperature Resistance: Provides excellent high-temperature resistance, capable of withstanding high-temperature environments in the FPC production process.
• Outstanding Filling and Release Performance: Offers excellent filling and release properties during production, preventing film adhesion.
• Defect Reduction: Effectively reduces adhesive overflow, wrinkles, and other defects during lamination, improving production yield.
• High-Performance Film: Ideal for high-performance film needs in FPC production, ensuring equipment stability and product quality.

Applications

• Semiconductor Flexible Printed Circuit Board (FPC) Manufacturing: Used in FPC production for protection and separation, ensuring product quality and yield.
• Electronics: Enhances process stability and reduces defect rates in the production of flexible circuit boards for electronic devices.
• High-Temperature Applications: Suitable for the production of various electronic products requiring high-temperature resistant films.

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