new material
UV Release Film provides excellent UV curing compatibility, superior release properties, and high durability. Designed for semiconductor processing, precision manufacturing, and optical applications, it ensures reliable performance, optimized adhesion control, and long-term surface protection.
Product Overview
UV Release Film is a specialized adhesive tape that provides excellent extensibility, making it easy to stretch and release particles, while also offering certain heat resistance to meet the demands of specialized temperature processes. This product is primarily used in chip cutting, electronic component cutting, and optoelectronic glass cutting applications. The adhesive force is strong before UV exposure, ensuring stability during the processing work; however, after UV exposure, the adhesive force almost completely disappears, making it easy to remove from the workpiece without leaving behind adhesive residue or contaminants.
Product Features
- High Adhesion:The adhesive force is high before UV exposure, ensuring stability of the workpiece during the processing phase.
- UV Responsiveness:After UV exposure, the adhesive force almost entirely disappears, making removal of the film from the workpiece easy.
- No Residue:No adhesive residue or contaminants are left behind after UV exposure, ensuring the workpiece surface remains clean and uncontaminated.
- Excellent Extensibility:Facilitates film stretching and particle extraction, improving work efficiency.
- Temperature Resistance:Offers some degree of heat resistance, making it suitable for specialized temperature processes.
Applications
- Chip Cutting:Ensures chip stability and prevents residue after cutting.
- Electronic Component Cutting:Provides stable adhesion during the processing of electronic components, ensuring cutting precision.
- Optoelectronic Glass Cutting:Suitable for cutting and protecting optoelectronic glass, ensuring high-quality surface treatment.
- Precision Processing:Used in other high-precision applications that require clean removal without leaving residue or contaminants.
