new material
Silicon carbide ceramic plates provide exceptional hardness, optimized thermal conductivity, and superior wear resistance. Designed for industrial and high-temperature applications, they ensure reliable durability, excellent mechanical stability, and efficient energy transfer.
Product Overview
The Silicon Carbide Ceramic Plate is a high-performance advanced ceramic material produced through a pressureless sintering process. It features a uniform and dense structure with exceptional hardness, strength, and thermal conductivity. Silicon carbide's ability to withstand high temperatures and corrosive environments, coupled with its low thermal expansion coefficient and superior chemical stability, makes it an essential material for a wide range of industries. It plays a pivotal role in advancing technology across fields such as mechanical manufacturing, aerospace, electronics, and chemical engineering.
Features
- High Hardness & Strength: The silicon carbide ceramic plate possesses extreme hardness and strength, making it capable of withstanding harsh working environments.
- High Thermal Conductivity & Heat Resistance: With excellent thermal conductivity and high-temperature resistance, it maintains stability even under extreme conditions.
- Corrosion Resistance: Its outstanding resistance to corrosion allows it to perform well in chemical and other corrosive environments.
- Low Thermal Expansion Coefficient: The low coefficient of thermal expansion ensures dimensional stability during temperature fluctuations.
- Superior Chemical Stability & Wear Resistance: Highly stable chemically and resistant to wear, making it suitable for demanding applications.
Applications
- Mechanical Manufacturing: Used in high-precision components such as seals, bearings, and cutting tools, providing superior mechanical performance.
- Aerospace: Ideal for engine parts, thermal protection systems, and other aerospace components, meeting the high-temperature and high-strength requirements.
- Electronics: Serves as substrate and packaging material for semiconductor devices, supporting high-performance electronic applications.
- Chemical Engineering: Applied in heat exchangers, fuel cell components, and other equipment requiring excellent corrosion resistance and high-temperature stability.
