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Product Overview
Molybdenum Copper (MoCu) packaging material is a composite of molybdenum and copper, offering adjustable thermal expansion coefficients and thermal conductivity. Its performance is similar to tungsten-copper, but with a lower density. This makes it especially suitable for aerospace and other applications requiring high performance and lightweight materials.
Product Features
- High Thermal Conductivity:Free from sintering activation elements like Fe and Co, ensuring superior thermal conductivity.
- Excellent Sealing Performance:Offers exceptional hermeticity, ideal for applications requiring high gas tightness.
- Lower Density:Compared to tungsten-copper, MoCu has a lower density, making it suitable for lightweight applications in electronic devices and aerospace.
- Customizable Forms:When the molybdenum content is less than 75%, rolling plates can be provided, making it easier to stamp into parts.
- Surface Treatment:Available as semi-finished products or finished products with Ni/Au plating on the surface.
Applications
Molybdenum copper packaging material is widely used in aerospace, particularly for electronic devices and packaging materials that require high thermal conductivity, low density, and excellent hermetic properties.
| Grade | Composition | Performance | ||||
| Density | Thermal Expansion Coefficient (ppm/K) | Thermal Conductivity (W/m.K) | ||||
| Component | Content | Mass Density (g/cm³) | Relative Density (%T.D.) | |||
| Mo70Cu30 | Mo | 70±1 | 9.7 | ≥99 | 7.6~7.8 | 190~200 |
| Cu | balance | |||||
| Mo60Cu40 | Mo | 60±1 | 9.6 | ≥99 | 8.3~8.5 | 200~220 |
| Cu | balance | |||||
| Mo50Cu50 | Mo | 50±1 | 9.5 | ≥99 | 9.7~9.9 | 220~250 |
| Cu | balance | |||||
