High-Purity Hexagonal Boron Nitride Microparticles
High-Purity Hexagonal Boron Nitride Microparticles
High-Purity Hexagonal Boron Nitride Microparticles
High-Purity Hexagonal Boron Nitride Microparticles

High-Purity Hexagonal Boron Nitride Microparticles

  • element:Boron (B), Nitrogen (N)
  • purity:≥99.5 wt%
  • shape:Microparticles
  • specification:Microparticle Diameter: 0.3-2 µm
  • packaging:Customizable

High-purity hexagonal boron nitride (h-BN) microparticles offer superior thermal stability, excellent electrical insulation, and outstanding lubrication properties. Designed for coatings, electronics, and composite materials, they ensure efficient heat dissipation, extended durability, and high adaptability.

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Product Overview
High-purity hexagonal boron nitride (h-BN) microparticles are a type of two-dimensional nanomaterial with exceptional electrical insulation, thermal conductivity, and high-temperature resistance properties. The purity of this material exceeds 99.5 wt%, with a low B₂O₃ content, typically less than 0.2 wt%. These microparticles are widely used in applications requiring high purity and precise material control. The unique hexagonal structure of boron nitride makes it suitable for various industries, including electronics, thermal management, and refractory materials.

Key Features

  • High Purity:The low B₂O₃ content ensures the material's purity exceeds 99.5 wt%, offering superior performance in demanding applications.
  • Excellent Thermal Conductivity:Provides efficient heat dissipation, making it ideal for thermal management materials.
  • Superior Electrical Insulation:Excellent electrical insulation properties, ideal for use in electronic devices.
  • High-Temperature Resistance:High thermal stability, able to withstand extreme temperature environments, making it suitable for refractory applications.

Applications

  • Transistors:Used in high-performance electronic devices, particularly in transistor applications for advanced electronics.
  • Thermal Management Materials:As an excellent thermal conductor, h-BN microparticles are ideal for use in heat dissipation and thermal management systems.
  • Insulating Materials:Suitable for electrical insulation in various electronic devices due to their high electrical resistivity.
  • Refractory Materials:Used in high-temperature applications requiring stable material performance in extreme heat environments.
  • Hot Pressing and Lubrication Demolding:h-BN microparticles are effective in hot pressing processes and as lubricants for demolding.
  • Benzene Adsorbents:Ideal for adsorbing and removing benzene and related compounds from gases or liquids.

 

ParameterValue
B2O3≤0.2 wt%
Flake Size0.3-2 μm
Purity≥99.5 wt%

 

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