new material
High-Performance Polyimide Film delivers exceptional thermal stability, superior electrical insulation, and outstanding mechanical strength. Designed for aerospace, electronics, and industrial applications, it ensures durability, reliability, and high-performance processing capabilities.
Product Overview
High-performance polyimide film is an electronic-grade material primarily used in flexible printed circuit boards (FPC), LED flexible circuit boards, cover films, reinforcing plates, and high-temperature resistant electronic tags. Its unique chemical and physical properties make it highly versatile for electronic and electrical applications, especially for use in high-temperature environments.
Product Features
- Excellent Dimensional Stability: Maintains stable dimensional properties even under high temperatures and long-term use, ensuring reliability in applications.
- Good Electrical Performance: Exhibits strong insulation strength, high volume resistivity, and surface resistivity, making it ideal for electrical isolation applications.
- High-Temperature Resistance: Exceptional heat resistance ensures its suitability for environments requiring long-term high-temperature exposure, guaranteeing material stability and durability.
- High Mechanical Strength: The material features high strength and good flexibility, making it suitable for flexible circuit board manufacturing.
Applications
- FPC Flexible Circuit Board Substrate: Widely used in flexible circuit boards for electronic products, particularly in mobile phones, TVs, and other consumer electronics.
- LED Flexible Circuit Board Substrate: Used in LED displays and other lighting products, improving product thermal stability and electrical performance.
- Electronic Tags: Suitable for electronic tags that require high temperature resistance and superior electrical performance.
- Cover Films and Reinforcing Plates: Used as protective films for electronic components, enhancing durability and functionality.
