Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder (Copy)
Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder (Copy)
Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder (Copy)
Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder (Copy)

Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder (Copy)

  • element:Aluminum (Al), Oxygen (O)
  • purity:≥99.9%
  • shape:Ellipsoidal Powder
  • specification:10-50 nm
  • packaging:Bulk packaging (25 kg/bag); Sample packaging (5 kg/bag)

Ellipsoidal alumina thermal conductive powder provides optimized heat dissipation, superior mechanical strength, and enhanced dispersion uniformity. Designed for advanced applications, it ensures efficient thermal conductivity, extended durability, and high-performance adaptability.

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Product Overview

Ellipsoidal alumina thermal conductive powder is a premium thermal filler designed to enhance thermal conductivity. The powder adopts an ellipsoidal structure, produced through a specialized preparation process, significantly improving dispersion and thermal conductivity in various thermal materials. It is widely used in electronics, communications, LED technology, and other fields requiring efficient thermal management.

Features

  • High Purity: Provides excellent thermal conductivity and stability.
  • Ellipsoidal Particles: The unique ellipsoidal structure improves powder flowability and dispersion, effectively increasing the thermal conductivity of composite materials.
  • Good Thermal Stability: Maintains stable thermal conductivity even in high-temperature environments, suitable for demanding thermal management applications.
  • High Thermal Conductivity: Significantly enhances the thermal conductivity of composite materials, ideal for a wide range of heat dissipation applications.

Applications

  • Thermal Phase Change Materials: Used in thermal management materials, such as flexible circuit boards (CCL).
  • Epoxy Potting and Molding Compounds: Acts as a filler to enhance the thermal conductivity of materials.
  • Thermal Conductive Aluminum Substrates: Widely used in aluminum circuit boards for high-efficiency heat dissipation.
  • Thermal Conductive Silicone Pads, Grease, and Encapsulants: Provides efficient thermal management solutions for electronics, LEDs, and other applications.

 

ModelParticle ShapeAverage Particle Size (D50)Al₂O₃ PurityNotes
LA001TEllipsoidal1μm≥99.8%Particle size can be customized, with D50 options of 2μm, 5μm, 10μm, 15μm, 22μm, 30μm, 50μm, 70μm
LA005TEllipsoidal5μm≥99.8%
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Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder (Copy)Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder (Copy)

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