CVD Diamond Heat Sink Grade Self-Supporting Film
CVD Diamond Heat Sink Grade Self-Supporting Film
CVD Diamond Heat Sink Grade Self-Supporting Film
CVD Diamond Heat Sink Grade Self-Supporting Film

CVD Diamond Heat Sink Grade Self-Supporting Film

  • element:Diamond
  • purity:High purity
  • shape:Thin Film
  • specification:Customizable
  • packaging:Customizable based on customer needs

CVD diamond heat sink grade self-supporting film is a high-performance synthetic diamond material designed for advanced thermal management applications. Manufactured through chemical vapor deposition (CVD), this film exhibits exceptional thermal conductivity, superior heat dissipation, and outstanding mechanical stability, making it ideal for high-power electronics, laser systems, and aerospace thermal control. Its self-supporting structure eliminates the need for backing materials, enhancing system reliability and efficiency across various industrial sectors.

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Product Overview

CVD diamond heat sink grade self-supporting films are produced using the DC arc plasma spraying method, featuring a polycrystalline structure without any metallic or non-metallic binders. The primary characteristic of this product is its extremely high thermal conductivity, making it particularly suitable for applications where heat dissipation is critical, such as high-power semiconductors and laser diodes. With its superior thermal properties, the CVD diamond film has become the preferred material for efficient heat dissipation.

Features

  • High Thermal Conductivity: The thermal conductivity of the diamond film is 1000-2000 W/m·K, 3~5 times higher than copper, and significantly surpasses materials like aluminum nitride, Cu-W alloy, alumina, and beryllium oxide.
  • Low Thermal Expansion Coefficient: It has an extremely low thermal expansion coefficient, helping to reduce damage caused by thermal stress.
  • Insulation: As an insulating material, the CVD diamond film effectively isolates electrical components, ensuring stable system operation.
  • High-Performance Thermal Management: Its exceptional thermal conductivity provides a significant advantage in high-power semiconductors, laser diodes, and other devices.

Applications

  • Semiconductor Power Devices: Used as substrate heat sink plates, providing excellent heat dissipation.
  • Electronic Packaging Substrates: Widely applied as a heat dissipation material in various electronic packaging technologies.
  • High-Power Laser Diodes and MCMs: Plays an irreplaceable thermal management role in laser diodes and multi-chip module (MCM) technologies.

 

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CVD Diamond Heat Sink Grade Self-Supporting FilmCVD Diamond Heat Sink Grade Self-Supporting Film

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