Copper pentasilicide (Cu₅Si) is a high-purity intermetallic compound known for its excellent electrical conductivity, thermal stability, and oxidation resistance. It is widely used in semiconductor applications, electronic components, high-temperature coatings, and specialized alloy manufacturing. Due to its superior durability and efficiency, copper pentasilicide plays a crucial role in scientific research, precision engineering, and advanced material processing.
Product Overview
Copper pentasilicide (Cu₅Si) is a binary silicide of copper, known for its high hardness, high density, and excellent electrical conductivity, thermal conductivity, ductility, and corrosion resistance. It is a metal intermetallic compound with properties between those of ionic compounds and alloys. Copper pentasilicide offers unique advantages in many high-end applications, particularly in electronic components, optoelectronic devices, and aerospace, with significant potential for further use.
Product Features
- High Hardness and Density: Provides strong physical stability, suitable for high-strength applications.
- Excellent Electrical and Thermal Conductivity: Ideal for high-performance electronic and thermal management applications.
- Ductility and Corrosion Resistance: Enhances the material's durability in harsh environments, extending its service life.
- Wear Resistance: Offers excellent surface protection, suitable for high-friction applications.
Applications
- Electronic Components: Used in electronic devices for electrical and thermal conductivity, improving device performance.
- Optoelectronic Devices: Applied in optoelectronic devices to enhance electrical efficiency and thermal management.
- Aerospace: A key material in aerospace components, improving high-temperature performance and reliability.
- Materials Science: Used in the development of new materials as an outstanding metal intermetallic compound.
- Thermal Management: Employed in thermoelectric management applications as a high-efficiency thermal conductor.
Technical Parameters | Values |
Name | Copper Silicide |
Crystal Structure | Polyhedral |
Molecular Formula | Cu₅Si |
CAS Number | 12159-07-8 |
EINECS Number | 235-286-8 |
Color/Appearance | Gray Powder |
Molecular Weight | 345.81 |
Melting Point | 825℃ |
Density | 7.7-7.8 g/cm³ |