Copper Back Plate

Product Overview
The copper back plate is a high thermal conductivity and electrical conductivity material used primarily in the electronics and optoelectronics fields. It possesses sufficient strength and is easy to process, making it widely used in technologies such as laser and electron beam evaporation. The copper back plate has a flat surface, effectively conducting heat and ensuring the cooling performance of target materials, thereby enhancing work efficiency. The processing of the copper back plate typically involves heating the plate and target material together, followed by brazing to firmly bond them.

Product Features

• High Thermal Conductivity:Copper’s excellent thermal conductivity helps improve thermal management performance
• High Strength:Ensures good stability even at high temperatures
• Easy to Process:Suitable for a variety of post-processing techniques, such as brazing
• Excellent Electrical Conductivity:Outstanding electrical conductivity for use in electronics
• Corrosion Resistance:Copper material offers good corrosion resistance in many applications

Applications

• Electronics Industry:Used for cooling and thermal management of electronic components
• Laser Technology:Widely used in laser equipment for heat dissipation and support
• Optoelectronics:Used in optoelectronic devices for thermal support and dissipation
• Mechanical Manufacturing:Applied in heat exchangers and high-temperature equipment
• Defense Industry:Used as a heat-conducting material in high-performance equipment