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Boron Nitride Powder is an advanced ceramic material composed of hexagonal boron nitride (h-BN) particles, renowned for its exceptional thermal stability (up to 3000°C in inert atmospheres), outstanding lubricity, and superior electrical insulation properties. This ultra-fine powder exhibits high thermal conductivity (≈600 W/mK in-plane), excellent chemical inertness, and low thermal expansion, making it ideal for thermal interface materials, high-temperature lubricants, ceramic composites, and release agents. With its white, non-abrasive characteristics and resistance to most molten metals, BN powder serves critical roles in metallurgy, electronics, aerospace, and advanced material research applications.
Product Overview
Boron Nitride Powder is an advanced ceramic material known for its unique hexagonal crystal structure. This material exhibits exceptional thermal conductivity, electrical insulation, chemical resistance, and oxidation resistance, making it suitable for a variety of high-temperature industrial applications. Manufactured through high-temperature reaction sintering at 2000°C, the chemical and physical properties of boron nitride powder remain stable, with excellent thermal conductivity (single crystal thermal conductivity of approximately 250-300 W/m·K). Our boron nitride powder comes in both plate-like crystalline powder and nano-spherical powder forms, widely used across electronics, metallurgy, casting, and lubrication industries.
Features
- Exceptional Thermal Conductivity: High thermal conductivity makes it an ideal material for heat management in electronic devices and other high-temperature applications.
- Electrical Insulation: Outstanding electrical insulating properties, suitable for high-voltage electrical and electronic applications.
- Chemical Corrosion Resistance: Provides strong resistance to most chemical substances, ensuring durability and longevity in challenging environments.
- Oxidation Resistance: Excellent stability in high-temperature and oxidative environments.
- High-Temperature Performance: Can withstand temperatures up to 1000°C in air and up to 2000°C in inert gases or vacuum environments.
Applications
- Electronics Industry: Used in thermal fillers, semiconductor packaging, LED thermal management, and various other applications in electronic component heat dissipation.
- Metallurgy and Casting: Acts as a high-temperature material and lubricant in high-temperature melting and casting processes.
- Specialized Lubricants: Serves as a filler in special lubricants, providing low frictionand efficient thermal management.
- Glass Industry: Used in glass productionas a high-temperature, chemically resistant material for furnace linings and other high-stress applications.
| Performance Indicator | PN | PW | TW | SW | HPBN |
| Purity (%) | >98 | >99 | >99.3 | >99.5 | >99 |
| Particle Size (D50) | 2-100µm | 2-100µm | 2-100µm | 2-20µm | 30-150µm |
| B₂O₃ (Boron Oxide) (%) | <1.2 | <0.5 | <0.2 | <0.1 | <0.5 |
| O₂ (Oxygen) (%) | <1.5 | <0.8 | <0.5 | <0.3 | <1 |
| Carbon (%) | <0.15 | <0.1 | <0.08 | <0.04 | <0.04 |
| Tap Density (g/cm³) | 0.2-0.6 | 0.2-0.6 | 0.2-0.6 | 0.1-0.3 | >0.7 |
| BET Surface Area (m²/g) | 2-35 | 2-35 | 2-35 | 6~25 | — |
| Si, Al, Ca (ppm) | <60ppm | <60ppm | <60ppm | <60ppm | <60ppm |
| Cu, K, Fe, Na, Ni, Cr (ppm) | <20ppm | <20ppm | <20ppm | <20ppm | <20ppm |
