Beryllium Oxide Ceramic Structural Components
Beryllium Oxide Ceramic Structural Components
Beryllium Oxide Ceramic Structural Components
Beryllium Oxide Ceramic Structural Components
Beryllium Oxide Ceramic Structural Components
Beryllium Oxide Ceramic Structural Components

Beryllium Oxide Ceramic Structural Components

  • element:Beryllium (Be)
  • purity:High purity
  • shape:Structural components
  • specification:Customized based on customer requirements
  • packaging:Vacuum packaging, cartons, wooden boxes

Beryllium oxide ceramic structural components offer exceptional thermal conductivity, optimized mechanical strength, and superior electrical insulation. Designed for high-performance applications, they ensure reliable durability, precise engineering adaptability, and efficient heat dissipation.

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Product Overview

Beryllium Oxide Ceramic Structural Components are high-performance ceramic materials known for their outstanding thermal conductivity and electrical insulation properties. With a thermal conductivity of up to 325 W/(m·K), these components are widely used in high-power electronic devices, high-frequency circuits, semiconductor manufacturing, and advanced defense technologies. The superior properties of beryllium oxide ceramics make them ideal for applications requiring significant heat dissipation and stability. Thanks to their low thermal expansion coefficient and high chemical stability, beryllium oxide ceramic components also serve as intermediate thermal management materials between silicon and metals, providing reliable support in extreme working environments.

Features

  • Excellent Thermal Conductivity: Beryllium oxide ceramic components have exceptionally high thermal conductivity, making them ideal for heat dissipation applications.
  • Good Thermal Stability: They can withstand high-temperature environments while maintaining stable performance.
  • Electrical Insulation: These components possess excellent electrical insulation properties, making them suitable for use in electronic components and high-frequency circuits.
  • Low Thermal Expansion Coefficient: Ideal for high-power electronic devices as an intermediate heat sink, supporting more robust component designs.
  • Chemical Stability: They exhibit superior stability in oxidative chemical environments, offering better chemical corrosion resistance than other materials, such as aluminum nitride.

Applications

  • High-Power Electronic Devices: Used in heat dissipation for equipment such as base stations, resistive networks, transistors, and power amplifiers.
  • Semiconductor Manufacturing: In semiconductor production, beryllium oxide ceramics provide excellent heat management to ensure the stable operation of devices.
  • Wireless Communications: Widely used in wireless communication equipment to provide both thermal management and electrical insulation support.
  • Defense Applications: In defense electronics, beryllium oxide ceramics are used in thermal exchange, heat dissipation, and high-frequency circuits.
  • Energy Equipment: Applied in energy devices that require high thermal conductivity and thermal stability.
  • Medical Equipment: In high-end medical devices such as DNA sequencers and defibrillators, they provide thermal management and heat dissipation solutions.

 

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