new material
Beryllium oxide ceramic sheets offer exceptional thermal conductivity, optimized electrical insulation, and superior mechanical stability. Designed for high-temperature applications, they ensure reliable heat dissipation, extended durability, and precision engineering adaptability.
Product Overview
Beryllium Oxide Ceramic Sheets are high-performance ceramic materials made primarily from beryllium oxide (BeO). These sheets are widely used in microwave power circuits and integrated circuits. By employing tungsten-manganese or molybdenum-manganese active metallization methods to achieve thick-film metallization, followed by nickel plating and graphic etching processes to form circuits, they exhibit excellent solderability and stable electrical properties. The high tensile strength and thermal stability of beryllium oxide ceramic sheets make them a critical material in high-tech applications.
Features
- Good Solderability: After nickel plating, beryllium oxide ceramic sheets exhibit excellent solderability, with minimal bubble formation during the soldering process.
- High Tensile Strength: The tensile strength exceeds 20 MPa after nickel plating, ensuring mechanical stability.
- High-Temperature Stability: The material does not bubble when nickel is fired at approximately 800°C in a reducing atmosphere, making it suitable for high-temperature applications.
- Excellent Electrical Properties: Through specialized metallization and nickel plating processes, the ceramic sheets can be used in high-frequency and microwave circuits, offering excellent electrical conductivity.
Applications
- Microwave Power Circuits: Used as substrates in microwave circuits, they are extensively applied in radar, satellite communications, and electronic devices.
- Integrated Circuits: Employed as substrates for integrated circuits, ensuring the stability and efficient operation of electronic components.
- High-Frequency Electronic Devices: Suitable for various high-frequency, high-power electronic components, ensuring long-term reliable operation.
- Electronic Packaging: Used as circuit board material, providing excellent thermal conductivity and electrical conductivity, enhancing the stability and heat dissipation capacity of packaging materials.
