new material
Product Overview
Aluminum Silicon Carbide (AlSiC) is a composite material that combines the advantages of aluminum and silicon carbide, offering exceptional properties such as low density, low thermal expansion, and high thermal conductivity. This material is primarily used in high-temperature and high-pressure environments and is ideal for electronic packaging, thermal management, and mechanical parts. Its outstanding thermal conductivity and stability make it the material of choice for high-performance electronic devices.
Key Features
- Low Density:Provides a lighter packaging solution compared to traditional materials.
- Low Thermal Expansion Coefficient:Ideal for high-temperature applications, reducing thermal stress.
- High Thermal Conductivity:Effectively enhances heat management, suitable for applications requiring fast heat dissipation.
- High-Temperature and Chemical Stability:Can withstand harsh working conditions.
- Customizable Processing:Materials and specifications can be tailored to meet specific needs.
Applications
- Electronic Packaging:Used in high-performance semiconductor packaging, providing excellent thermal management and electrical isolation.
- Thermal Management:Applied in high-power electronic devices as heat dissipation components.
- Automotive and Aerospace:Utilized as a thermal management material for engines, electronic systems, and other critical components.
- Mechanical Components:Offers stable mechanical properties in high-temperature and high-pressure environments.
- Medical Devices:Widely used in devices that require high thermal conductivity and reliability.
