Alumina Ceramic Heat Sink
Alumina Ceramic Heat Sink
Alumina Ceramic Heat Sink
Alumina Ceramic Heat Sink

Alumina Ceramic Heat Sink

  • element:Al₂O₃
  • purity:99%
  • shape:Rectangular, Square
  • specification:Customized per Customer Requirements
  • packaging:Customized Packaging per Customer Requirements

Alumina ceramic heat sinks offer exceptional thermal conductivity, optimized heat dissipation, and superior mechanical stability. Designed for electronic and industrial applications, they ensure efficient cooling, extended lifespan, and high-performance thermal management.

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Product Overview:
Alumina Ceramic Heat Sink, also known as ceramic base plates or substrates, is widely used in high-performance electronic devices, especially in improving the heat dissipation efficiency of semiconductor components. These heat sinks are primarily used in electronic components such as LED lighting systems, power transistors, and microprocessors, effectively absorbing and dissipating heat from electronic parts to prevent overheating. This ensures the stable operation of devices and extends their lifespan. The alumina ceramic material, with its high thermal conductivity, electrical insulation properties, and excellent mechanical performance, makes this product an ideal solution for thermal management.

Product Features:

  • High Thermal Conductivity:Alumina ceramic has a thermal conductivity of up to 27.5 W/(m·K), quickly absorbing and transferring heat away from electronic components, effectively mitigating overheating issues in electronic parts.
  • Excellent Electrical Insulation:With a breakdown strength of over 10 kV/mm and low dielectric loss, it provides electrical insulation while still enabling efficient heat transfer.
  • Mechanical Stability:With a compressive strength of up to 2000 MPa and a Vickers hardness of 15.7 GPa, it maintains stability and durability under high physical stress.
  • Thermal Stability and Thermal Shock Resistance:Can withstand temperatures up to 1650°C and has excellent resistance to thermal shock, making it suitable for extreme temperature cycling environments.
  • Custom Design:Heat sink dimensions, shapes, and thickness can be tailored to meet specific assembly and performance requirements.

Applications:

  • LED Lighting Systems:Used in LED components to optimize thermal management, extend the lifespan of LEDs, and maintain stable light output.
  • Power Semiconductors:Applied in high-power transistors and microprocessors to manage heat loads effectively, improving device performance and reliability.
  • High-Performance Computing:Used in high-speed computers, servers, and other devices to manage the heat generated from large-scale data processing.
  • Communication Devices:Applied in wireless communication devices to prevent overheating, ensuring stable device performance and maintaining signal stability.

 

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