Ultra-Thin Thermal Dissipation Film
Ultra-Thin Thermal Dissipation Film
Ultra-Thin Thermal Dissipation Film
Ultra-Thin Thermal Dissipation Film

Ultra-Thin Thermal Dissipation Film

  • element:Thermal Conductive Materials
  • purity:High-purity
  • shape:Thin Film
  • specification:Customizable
  • packaging:Customizable

Ultra-Thin Thermal Dissipation Film provides excellent heat transfer efficiency, superior flexibility, and enhanced durability. Designed for electronics, LED modules, and industrial thermal management, it ensures optimal heat dissipation, reliable surface protection, and long-term stability.

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Product Overview
The ultra-thin thermal dissipation film is an innovative thermal management material that applies four heat management principles—conduction, evaporation, convection, and condensation—to provide highly efficient cooling solutions. The film contains water, which absorbs heat and evaporates, carrying heat away. The vapor then condenses and returns as water via capillary action to the heat source, continuing to absorb heat and evaporate. This process quickly spreads the heat across a larger surface area, enabling efficient heat dissipation. Compared to traditional heat pipes and graphene materials, the thermal dissipation capacity of this ultra-thin film is several times that of heat pipes and tens of times that of graphene. Due to its excellent thermal management properties, the ultra-thin thermal dissipation film is widely used in high-frequency communications and renewable energy fields, making it an ideal solution for cooling communication base stations, smartphones, and power batteries in the future.

Product Features

  • High Efficiency Heat Dissipation:Its heat dissipation capability is several times better than heat pipes and tens of times that of graphene.
  • Four-Step Heat Dissipation Principle:The process utilizes conduction, evaporation, convection, and condensation to achieve efficient heat transfer.
  • Uniform Heat Distribution:Heat is evenly spread over short distances, ensuring optimal heat dissipation.
  • Ultra-Thin Design:The ultra-thin structure provides a more precise and efficient thermal solution.
  • Strong Adaptability:Suited for high-demand environments like ultra-high-frequency communications and renewable energy sectors.

Applications

  • Ultra-High Frequency Communication Base Stations:Provides stable and efficient heat dissipation to ensure the reliable operation of communication devices.
  • Smartphones:Used for rapid heat dissipation in smartphones, improving performance and extending lifespan.
  • Power Battery Charging/Discharging:Effective heat dissipation helps maintain temperature control during rapid charging and discharging, enhancing safety.
  • Renewable Energy Devices:Applied to thermal management in batteries, charging stations, and other renewable energy equipment.
  • Ultra-High Frequency Communication Devices:Efficient heat dissipation to support devices operating at higher frequencies.

 

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