Nano Magnesium Oxide for Thermal Conductive Materials
Nano Magnesium Oxide for Thermal Conductive Materials
Nano Magnesium Oxide for Thermal Conductive Materials
Nano Magnesium Oxide for Thermal Conductive Materials

Nano Magnesium Oxide for Thermal Conductive Materials

  • element:Magnesium (Mg), Oxygen (O)
  • purity:≥99.0%
  • shape:Powder
  • specification:Nano-sized particles
  • packaging:Bulk packaging (20 kg/bag), Sample packaging (5 kg/bag)

Nano magnesium oxide for thermal conductive materials provides optimized heat dissipation, superior thermal stability, and enhanced dispersion uniformity. Designed for advanced applications, it ensures efficient thermal conductivity, extended durability, and high-performance adaptability.

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Product Overview

Nano magnesium oxide is an efficient thermal conductive material widely used in electronic devices, semiconductor packaging, and high-performance composite materials. Its nano-sized particles and high purity provide excellent thermal conductivity and insulating properties, significantly improving the heat dissipation efficiency and thermal management of materials. This material is especially suitable for thermal interface materials, semiconductor sealing materials, and thermoplastic resin composites, enhancing the heat dissipation performance of electronic products.

Features

  • Excellent Thermal Conductivity: Nano magnesium oxide has an extremely high thermal conductivity, effectively enhancing heat dissipation.
  • Nano-sized Particles: Small particle size increases the surface area, improving dispersion and thermal contact properties.
  • High Purity: ≥99.0% purity ensures material stability and efficiency.
  • Good Insulating Properties: Offers excellent electrical insulation, making it suitable for high-voltage environments.
  • Eco-friendly: As an inorganic material, it is environmentally friendly and meets green material standards.

Applications

  • Thermal Interface Materials (Heat Sinks, Grease, etc.): Used in electronic devices for improved heat management and enhanced heat dissipation.
  • Thermoset Resins (Silicone Rubber, Acrylic Resins, etc.): Improves thermal conductivity and extends the lifespan of resin materials.
  • Semiconductor Sealing Materials: Enhances thermal conductivity of semiconductor packaging materials, prolonging product life.
  • Thermoplastic Resin Composites (e.g., PPS, LCP): Acts as an additive to improve the thermal conductivity and stability of resins.
PropertyValue
ModelMG20R
Magnesium Oxide Purity (≥)≥99.9%
Primary Particle Size (SEM)20-30nm
Specific Surface Area (m²/g)8~20
pH Value8.0-11.0

 

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