Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder
Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder
Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder
Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder

Ellipsoidal High Purity Nano Alumina Thermal Conductive Powder

  • element:Aluminum (Al), Oxygen (O)
  • purity:≥99.9%
  • shape:Ellipsoidal Powder
  • specification:10-50 nm
  • packaging:Bulk packaging (25 kg/bag); Sample packaging (5 kg/bag)

Ellipsoidal high-purity nano alumina thermal conductive powder provides optimized heat dissipation, superior mechanical strength, and enhanced dispersion uniformity. Designed for advanced applications, it ensures efficient thermal conductivity, extended durability, and high-performance adaptability.

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Product Overview

Ellipsoidal high purity nano alumina thermal conductive powder is a high-purity material designed for excellent thermal conductivity. The ellipsoidal particle structure enhances the powder's dispersion and stability, making it ideal for use in thermal conductive composite materials. This product is widely used in electronics, communications, LED technologies, and other fields that require efficient thermal management.

Features

  • High Purity: Made from high-purity alumina to ensure superior thermal conductivity.
  • Ellipsoidal Particles: The unique ellipsoidal shape improves particle dispersion and packing efficiency, enhancing the material's thermal conductivity.
  • Excellent Thermal Stability: Retains stable thermal conductivity even under high-temperature conditions, suitable for high-temperature applications.
  • High Thermal Conductivity: Significantly improves the thermal conductivity of composite materials, making it ideal for high-efficiency heat dissipation.

Applications

  • Thermal Phase Change Materials: Used in electronic cooling materials such as flexible circuit boards (CCL).
  • Epoxy Potting and Molding Compounds: Acts as a filler to enhance the thermal conductivity of materials.
  • Thermal Conductive Aluminum Substrates: Applied in aluminum circuit boards for efficient heat dissipation.
  • Thermal Conductive Silicone Pads, Grease, and Encapsulants: Provides high-efficiency thermal management solutions in industries like electronics and LED lighting.

 

ModelParticle ShapeCrystal FormPrimary Particle Size (SEM)Al₂O₃ Purity
LA300DEllipsoidalα200-300nm≥99.99%
LA500DEllipsoidalα600-800nm≥99.9%

 

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