Spherical Alumina Thermal Conductive Powder
Spherical Alumina Thermal Conductive Powder
Spherical Alumina Thermal Conductive Powder
Spherical Alumina Thermal Conductive Powder

Spherical Alumina Thermal Conductive Powder

  • element:Aluminum (Al), Oxygen (O)
  • purity:High Purity
  • shape:Spherical Powder
  • specification:From Nano to Micron Range
  • packaging:Bulk packaging (25 kg/bag); Sample packaging (5 kg/bag)

Spherical alumina thermal conductive powder provides optimized heat dissipation, superior mechanical strength, and enhanced dispersion uniformity. Designed for advanced applications, it ensures efficient thermal conductivity, extended durability, and high-performance adaptability.

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Product Overview

Spherical alumina thermal conductive powder is a high-quality aluminum oxide powder prepared using a special process to form spherical particles, offering excellent thermal conductivity. This product is widely used in thermal management materials to significantly enhance the thermal conductivity of systems, ensuring efficient heat dissipation. It is extensively applied in electronics, semiconductors, optoelectronics, and other high thermal load fields.

Features

  • Excellent Thermal Conductivity: Significantly improves the thermal conductivity of materials, ensuring efficient heat management.
  • Spherical Particles: The spherical shape enhances dispersion in materials, reducing aggregation and improving stability.
  • High Purity: High-purity alumina powder ensures high performance and long-lasting durability of the material.
  • Versatile Applications: Suitable for a wide range of thermal conductive products, ensuring effective temperature control in systems.
  • Non-Toxic and Environmentally Friendly: Meets environmental safety standards and can be used safely.

Applications

  • Thermal Phase Change Materials: Enhances thermal conductivity in flexible circuit boards (CCL) and other thermal management systems.
  • Epoxy Molding and Casting Compounds: As a thermal conductive filler, used to improve the heat dissipation capabilities of aluminum-based substrates and other electronic packaging materials.
  • Thermal Conductive Silicone Pads and Grease: Applied to various electronic components for heat transfer, including mobile phones, LED lights, computers, etc.
  • Thermal Conductive Potting Compounds and Double-Sided Adhesives: Used in electronic devices to optimize heat dissipation and improve the overall thermal performance.
PropertyLA02QLA22Q
Particle ShapeSphericalSpherical
Average Particle Size (D50)2μm22μm
Al₂O₃ Purity≥99.85%≥99.85%

 

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